Xiaomi was said to be working on its new flagship device called Mi Mix 2S a successor to the last year’s Mi Mix 2 which was later on confirmed by the press like renders listed on a Chinese website Weibo.
The leaked renders suggested the device will flaunt a similar bezel-less four-sided ceramic uni-body design like its predecessor. Now a leaked firmware provided by XDA Developers reveals some more information and affirming the previous details as well.
According to a new update, the Xiaomi Mi Mix 2S will flaunt a taller front bearing 18:9 aspect ratio and with a full HD+ display. The hardware of the device will be powered by the latest and top-notch Snapdragon 845 chipset from Qualcomm.
The battery powering the phone will offer 3,400mAh capacity. As for the optics, it will pack a Sony IMX363 image sensor alongside AI technology and scene recognition support.
Moving on, the firmware further reveals the phone will come with dual SIM slots. It will come with an IR blaster and an LED light for notifications. The source further reveals that the firmware Android Oreo is massive so there’s a lot to dig through with other information remaining unknown.
For a recap, earlier reports suggest the Mi Mix 2S will sport a 5.99-inch FHD+ display, will be offered in 6GB and 8GB RAM variants, storage department will offer up to 256GB of storage.
It will pack a dual primary camera setup at the rear, whereas the front will have a small notch on the top right corner for the selfie flash.
There are no official words as of now but the device is expected to be unveiled at the upcoming MWC 2018 in Barcelona, Spain.